Apr

7

Intel Shanghai IDF: Unleasing Mobile Internet

Filed Under Memory and Storage, Microprocessor, PC Industry, Video Gallery | Leave a Comment

Intel’s Developer Forum (IDF) is becoming a high profile premier event in the semiconductor industry and receiving a lot of internet publicity. The event provides a good glimpse of the forthcoming digital technology that would shape the future.

Following the successful Intel spring IDF event at Beijing last year, this year Intel spring IDF was held at Shanghai last week. The key theme for this event was “unleashing the internet with mobile devices” or more aptly in Chinese ” 芯动力，新世界” and the focus was on mobile internet devices (MIDs). Intel is apparently going all out to grab a bite on this new market by introducing new enabling technologies for MIDs such as Atom processors and solid-state drives (SSD) in the coming months. These devices are all designed to have very small footprint and low power. Other major processor companies such as AMD, Nvidia and Via Technologies are all vying for the MID market as well.

In the following videos, you can replay most of the highlights in this Intel Shanghai IDF. In these videos, Intel Ultra Mobility VP Anand Chandrasekher shared the latest development on Atom processors. He held up the smallest chipsets for Atom processors known as Moorestown which he called “the heart” of future mobile Internet devices. Atom processors are also going to used in Intel’s low cost PC, the classmate PC. Patrick Gelsinger, Intel’s senior vice president and Digital Enterprise Group general manager in Shanghai, talked on next generation processors for server and desktop, “Nehalem” and “Dunnington”. David Perlmutter, executive vice president and general manager of Intel Corporation’s Mobility Group, shared on the outlook of solid state disks & a common chip architecture.

Related posts

Mar

3

Intel’s New Atom Processors target at MID markets

Filed Under Microprocessor, Video Gallery | Leave a Comment

The Intel has officially dubbed its previously code-named Silverthorne and Diamondville microprocessor chips as Atom (Ref). The new brand name reflects the small size and incredible performance of this new family of microprocessors. Atom is targeted at Mobile Internet Devices (MID) which demand for ultra low power and high performance. It is also targeting at lower-end, internet-centric mobile computer market. An Atom chip is less than 25 square millimeters and manufactured using Intel’s latest 45nm high-k metal-gate technology. The chips have a thermal design power (TDP) specification in 0.6-2.5 watt range and capable of scaling to 1.8GHz speeds. By comparison, mobile Core 2 Duo processors have a TDP in the 35-watt range (Ref).

Atoms are expected to hit the market early yet this year. Anand Chandrasekher, Senior VP of Intel’s Ultra Mobility Group talked about this new brand of Intel’s chips in the following video.

 

Related posts