• Feed and Bookmark

  

• Categories

  • Analog and RFIC (3)
  • Book Recommendations (11)
  • Chip Design (4)
  • Consumer Electronics (15)
  • EDA and IP (4)
  • Educational (11)
  • Emerging Technology (23)
  • Equipment (8)
  • Foundry (23)
  • FPGA and ASIC (1)
  • GPU and Gaming (15)
  • Market Research (9)
  • Memory and Storage (22)
  • Metrology (5)
  • Microprocessor (49)
  • Movers and Shakers (30)
  • Packaging and Testing (3)
  • PC Industry (20)
  • Process Technology (8)
  • Related Industry (20)
  • Semiconductor Industry (51)
  • Softwares (7)
  • System Designs (2)
  • Video Gallery (141)
  • Yield Mgt and DFM (5)

• Tag Clouds

  3D 32nm 40nm 45nm 64bit 65nm 90nm 193nm 300mm Altera AMAT AMD AMKOR Anantech Apple Applied Material ASML ATI Barcelona bill gate blu-ray Broadcom cache Cadence Caneland carbon nanotube CeBIT cell processor CES Chartered Chia Song Hwee China chip chips CMOS CMP Common Platform Core 2 Duo CPU Crolles CrossFire Cu DAC Dell design double exposure double patterning DP DRAM dual-core EDA and IP EDB EETimes energy Equipment EUV fab fabless fablite fabs FairChild Semiconductor FBC flash Flash memory forecast Foundry Freescale Fujitsu Fusion G92 Gartner GeForce Google Gordon Moore GPU graphics chips Hector Ruiz high-k high-NA Hitachi Hynix IBM IC IDF IDM IEDM IEEE IME IMEC IMFlash immersion Infineon Intel Intel IDF interconnect inventory IP iPhone iSuppli Jen-Hsun Huang Kelin Kuhn KLA Tencor Korea litho lithography low power MacBook Air manufacturing maskshop Memory metal-gate Micron Microprocessor microprocessors Microsoft MIT Montevina Moore's Law Morris Chang Motorola MPU multi-touch NAND Nanya National Semiconductor NEC Nehalem NOR Novellus NTU Numonyx Nvidia NXP OEM open source Opteron packaging PCM Penryn phase change memory Phenom Philips photoresist processor processors Qimonda quad-core Qualcomm Radeon REC recycling Related Industry RFIC Samsung SEMICON semiconductor SEMICON WEST SiKoD Silverthorne Singapore smic SoC SOI SOITEC solar Solar Morph solar panel solid-state drive Sony Spansion Spider platform SPIE SRAM SSD SSMC Steve Job Steve Jobs STMicro STMicroelectronics Sun Microsystems Taiwan TEL TI Toshiba transistor TSMC UltraSPARC ultratech UMC UMPC US UTAC Vista VLSI Research VLSI Symposium x86 Xeon Xilinx Yield Yield Mgt and DFM

• Archives

  • November 2008 (2)
  • October 2008 (1)
  • August 2008 (1)
  • July 2008 (6)
  • June 2008 (6)
  • May 2008 (6)
  • April 2008 (9)
  • March 2008 (8)
  • February 2008 (6)
  • January 2008 (9)
  • December 2007 (6)
  • November 2007 (7)
  • October 2007 (8)
  • September 2007 (8)
  • August 2007 (7)
  • July 2007 (9)
  • June 2007 (7)
  • May 2007 (9)
  • April 2007 (7)
  • March 2007 (10)
  • February 2007 (12)
  • January 2007 (25)
  • December 2006 (13)

• Calendar

  July 2008

  M	T	W	T	F	S	S
  « Jun				Aug »
  	1	2	3	4	5	6
  7	8	9	10	11	12	13
  14	15	16	17	18	19	20
  21	22	23	24	25	26	27
  28	29	30	31

• Support SiKoD

  

iPhone 3G was launched over the last weekend. Within 3 days, more than a million iPhone 3G have been sold (Ref). The iPhone 3G manic is simply amazing and Apple has demonstrated once again its unbeatable marketing prowess. Minutes after the launch, the Internet has published a couple of articles on the teardown analysis of iPhone 3G handset. Based on these articles, we list a summary of the components used by iPhone 3G over here (Ref1, Ref2, Ref3):

• ARM Processor: Samsung
• 3G Communication: Infineon (previously Broadcom)
• GPS: Infineon
• NAND: Toshiba (previously Samsung)
• Baseband NOR: Numonyx
• Audio Codec: Wolfson Microelectronics
• Power Amplifier: TriQuint
• Power Control: NXP
• Battery and USB: Linear Technology
• Touchscreen: Broadcom, NXP, TI
• Others: Skyworks

The clear winner is obviously Infineon which has four design wins in the iPhone 3G, including the 3G communication chip. Below is a two part teardown anaysis by Semiconductor Insight.

Related posts

• iPhone Launch Mania (0)
• IBM Bigger and STM Leaner (0)
• Will IMEC become a IBM-like Technology Alliance? (0)

Tags: 3G, Apple, Broadcom, CPU, Flash memory, Infineon, iPhone, Numonyx, NXP, Samsung, Toshiba, TriQuint, Wolfson Microelectronics

Comments

• Search for:

• Enter your email address to subscribe from FeedBurner

  

• Recent Posts

  • SOI CMOS gaining traction
  • AMAT generous Singapore Tech Forum
  • Global semiconductor slump has taken a toll on Singapore IMFlash and Qimonda mega fab projects
  • Intel takes on AMD and Nvidia with new graphic chips Larrabee
  • Explosive Growth for Thin Film Photovoltaic (TFPV) Market
  • SEMICON WEST: Double Patterning for 32nm and 22nm
  • AMD changed chief
  • iPhone 3G Teardown
  • More Semicon Companies Switch Gear to Solar
  • Singapore solar industry soars with oil price
  • Highlights of VLSI Symposium 2008
  • Siltronic Samsung Wafer Official Opening in Singapore
  • Cinematic 2.0 graphic chips
  • EverSpin - The new MRAM company
  • Nano vs Atom Processors vs Puma Platform at Taiwan Computex 2008

• Recent Comments

  • HeleMenna on One big friend gathering at AMAT Singapore Tech Forum
  • Mario Holmes on Is IBM a Technology company or a Service company?
  • Faron Rowland on Intel Shanghai IDF: Unleasing Mobile Internet
  • Andre Rodriquez on Xilinx races towards 45nm in Singapore
  • Lawrence Conner on AMD uphill battle against Intel
  • Herman Shaffer on Intel Future Vision of UMPC
  • sram on IEDM ushers 32nm race into 2008
  • fpga arm on Xilinx races towards 45nm in Singapore
  • nanotube use on Carbon nanotube is cancerous!!
  • Ang Chew Hoe on Xilinx races towards 45nm in Singapore

• Random Photos

• Semiconductor Slides